Successful Completion of Phone Call Using Comlent TD-SCDMA Transceiver Confirms Technology Readiness for China's 3G (Net to phone calls)

Successful Completion of Phone Call Using Comlent TD-SCDMA Transceiver Confirms Technology Readiness for China's 3G
Comlent Technology Inc., Chinas leading fabless radio-frequency integrated circuit (RFIC) design house, announced today that its transceiver for third generation (3G) mobile terminals (TD-SCDMA standard) successfully completed a phone call on a TD-SCDMA network. Comlent is the first Chinese RFIC chip company to achieve this milestone. Strong local transceiver and baseband IC (BBIC) chipset
Source: www.prweb.com

Man Gets $218 Trillion Phone Bill
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Source: abclocal.go.com